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Introduction to the basic principles of valve bonding and selection of inorganic adhesives

Release Date: August 06, 2018

1. Basic principles of bonding:

Bonding is a complex physical and chemical process. The generation of adhesive force depends not only on the surface structure and state of the adhesive and the adherend, but also on the process conditions of the bonding process. The source of adhesion is also multifaceted. ① The action of chemical bonds existing between atoms (or ions). ② Inter-molecular forces. ③ The electrostatic attraction at the interface between the metal adherend and the polymer adhesive. ④ The mechanical force of the surface to be bonded effectively improves the bonding effect.

2. Selection of inorganic adhesives:

The valve has a wide temperature range, and the heat resistance of organic adhesives is very limited. Even high-performance fen heterocyclic resin adhesives can only be used at 200 to 400 ° C. Compared with organic adhesives, inorganic adhesives have better heat resistance, and products with a temperature resistance above 800 ° C are already available. Inorganic adhesive has the characteristics of non-combustion, high temperature resistance and durability, which can meet the requirements of valve fire resistance, high temperature, high pressure and long life. The inorganic adhesives include silicate, phosphate, copper oxide, and inorganic adhesive formulations for common metals.

3. Formula and performance of copper oxide inorganic adhesive:

Copper oxide inorganic adhesive (Table 1) is composed of concentrated phosphoric acid, aluminum oxide and copper oxide powder. The main reaction formula of the bonding process is 2H3PO4 + 3CuO → Cu3 (PO4) 2 · 3H2O.